ball grid arrays for .050? grid male pin adapters & female socket www.mill-max.com 516-922-6000 112 series 587, 582 for bga mount adapter pins for bga female socket 2 7 8 ? bga adapter/socket systems are a reliable way to make bgas pluggable, they may also be used as a high density board-to-board interconnect. ? the bga device is soldered to a 8737/4048 adapter (or a 4098/4054 adapter is soldered to a pcb); and then either one can be plugged into a 8214 surface mount socket. ? both socket and adapter have the same footprint as the bga device. ? insertion force is .40n per pin for standard pins 8737/4098. tapered ez-in pins 4048/4054 reduce insertion force to only .08n, and are recommended for pin counts greater than 500. a pry-bar tool (part #828-01-010) is available for extraction. ? insulator material is fr-4 epoxy having a tce to match the bga device and circuit board. ? mill-max offers the option of having the solder surfaces of the 4098/4054 adapters and 8214 socket pre-tinned. .034 dia. .018 dia. .034 dia. .016 dia. .013 dia. .127 .062 .068 .043 dia. .036 dia. .022 dia. .024 .062 .115 .140 ordering information series plating window 8 1 0 4 7 code - - -- no. of pins grid size pattern # determined from footprint pattern pages 113 to 115 3 specify plating code xx= sleeve (pin) contact (clip) 11 10 ?au 10 ?au series plating window 1 1 4 4 code - --- no. of pins grid size pattern # determined from footprint pattern pages 113 to 115 1 plating code xx= pin plating 10 10 ?au bga mount adapter pins 5 0 4 1 0 4 8 - - -- 4 5 for pcb mount standard adapter pin 0 4 1 0 4 8 - - -- 9 5 7 9 1 0 4 6 - - -- 1 5 for pcb mount ez-in adapter pin 0 4 1 0 4 4 - - -- 5 5 7 9 1 0 4 0 - - -- 3 5 5 5 9 1 1 4 6 - --- 2 5 pre- tinned pre- tinned ez-in pin stan- dard pre- tinned .022 dia. .034 dia. .018 dia. .062 .127 .091 .023 .022 dia. .034 dia. .016 dia. .013 dia. .062 .127 .091 .023 standard pin #8737 ez-in pin #4048 pcb mount standard adapter pin #4098 pcb mount ez-in adapter pin #4054 smt receptacle type #8214
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